Our diamond blade with Hub is with a stronger edge, which makes the blade more rigid and keeps the edge not to be broken, so the cutting with the blade is in high efficiency and of excellent quality. This wheel is mainly used for the cutting and dicing wafers of silicon, GaAs, gap, pzt, etc.
Specifications of Dicing Blades With Hub
Product Specification
Available shape 14A1
Working Condition
Grinding Type Wet less
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